盖带Cover tape

产品介绍
Introduction

盖带和载带配合使用,搬运半导体封装电子元器件至表面装配工程。

Cover Tapes (SUMILITE®CSL-Z) is used for carrier of semiconductors and electrical components packing in SMT process. This tape should be used with carrier tape.

特征
Feature

高强度,高速装配也安心

使用强韧素材,即使在高速装配机剥离,盖带也不会断裂。(合理封合及剥离的情况下)

广泛的封合条件

对封合温度和压力的依存性极小,容易得到所希望的剥离强度。

优异的封合安定性

封合后的剥离强度,随时间流逝变化极小,长期保管也安心。

不挑载带材质

PS,PC,PET,纸等各种材料的载带,均可封合。

透明性

拥有高透明性。

Tearing-free at high speed mounting process

No tearing at high-speed mounter by high endurance material. (If used under proper sealing/peeling condition)

Wide sealing operation range

Required peeling strength can easily be obtained since our cover tape is not dependent much on sealing temperature and pressure.

Superior sealing stability

Small aged deterioration of peel strength after sealing. High stronger reliability at high temp and humidity

Wide adaptability to carrier tape

Cover Tapes (SUMILITE®CSL-Z) can be sealed to many kinds of carrier tape. E.g. PS,PC,PET, or Paper.

Transparency

Cover Tapes (SUMILITE®CSL-Z) has high transparency.

品番
Grade

CSL-Z7302

CSL-Z7500

多层共挤技术Co-extruded Multilayer Technology

联系方式

contact information

日本 Japan
北美 North America
欧洲 Europe
亚太地区 Asia-Pacific